- SK Hynix completes HBM4 development and prepares technology for mass production
- Nvidia Rubin AI processors should present the new HBM4 fleas from SK Hynix
- HBM4 doubles connections and improves the efficiency of 40%
The South Korean memory giant SK Hynix says that it has completed development work on HBM4 and is now preparing technology for mass production.
This highlights its Samsung and Micron rivals, which always develop their own versions.
The chips should appear in the new generation of NVIDIA Rubin AI processors, and will play an important role in the propulsion of future workloads of artificial intelligence.
Beyond the limitations of the IA infrastructure
Joohwan Cho, HBM Development Head at SK Hynix, said: “The completion of HBM4 development will be a new step for industry. By providing the product that meets customer needs in terms of performance, energy efficiency and timely reliability, the company will respond to market and maintain a competitive position. ”
High bandwidth memory, or HBM, stacks the dram layers vertically to speed up data transfer.
The demand for high bandwidth memory has increased with the overvoltage of IA workloads, and energy efficiency has become an urgent concern for data centers operators.
HBM4 doubles the number of E / O connections compared to the previous generation and improves energy efficiency by more than 40%.
The Korean memory manufacturer says that this results in higher flow and lower energy consumption in data centers, with service performance gains up to 69%.
HBM4 exceeds the standard operating speed of the Jedec industry of 8 Gbit / s by exceeding 10 Gbit / s.
SK Hynix has adopted its advanced MR-MUF process for flea stacking, which improves heat and stability dissipation, as well as 1BNM process technology to help minimize manufacturing risks.
Justin Kim, president and head of AI infra to SK Hynix, said: “We reveal the creation of the first mass production system in the world of HBM4. HBM4, a symbolic turning point beyond the limitations of the AI infrastructure, will be a basic product to overcome technological challenges. manner.”
