- Qualcomm shows a mini PC snapdragon in the shape of a saucer at its 2025 summit
- Reference Concept Elite Ultra Thin Snapdragon X2 Elite Refroit with Airje modules
- If it will be created is uncertain, but the concept shows a potential
During its recent Snapdragon Summit 2025, Qualcomm surprised the participants with two new reference computers fueled by its next Snapdragon X2 Elite chips.
Among them, the most unusual design was a flat circular computer that could easily be confused with a cup charger or a wireless charger, according to PcmagJohn Burek, who photographed the device.
The mini PC ultra-thin is less than half a pump thick and just slightly larger than a tea cup saucer.
Jet cooling
On its sides, a handful of USB-C ports and a headphone jack, with a ring of vents below which Burek underlines recalls the Mac Mini.
The display machine has been connected to a full-size screen via USB-C while running Snapdragon silicon in real time.
Cooling such a thin device is an obvious challenge, and Qualcomm turned to the Airje Systems Airjet technology for this.
Instead of relying on the fans, the Airje modules use thermoelectric materials that pulse through the heating dissipator in silence.
Without mobile parts, cooling avoids mechanical wear and noise, while allowing much thinner conceptions.
Qualcomm has noted that Airjet is an option currently explored, with traditional fans or fully -free approaches that are also possible depending on the performance targets.
The saucer’s PC appeared alongside another all-in-one modular office, illustrating Qualcomm’s interest in exploring form factors beyond laptops and tablets.
Burek has reported that Qualcomm works with three OEMs based in Taiwan on reference models, which increases the chances that certain designs can reach the market.
Looking at the black saucer -shaped computer photos that was the subject of the V3 MINI PC Voyo that we examined in 2016.
This device was less than 10 mm thick and weighed less than 200 g. It was based on a chip of cherry trail atoms with a low -power print, but the thermal problems have limited performance due to the absence of a fan or a chassis dissolving heat.
Compared to this machine, the Qualcomm reference office is just as surprisingly thin, but promises much higher performance thanks to its more powerful arm fleas and its modern cooling.
The new concept shows how Snapdragon Hardware could develop in new categories, and although this conception of the saucer can never go beyond the prototype stage, I will certainly be at the front of the queue if ever.
