AMD revealed more about its DLC 128-GPU MI355X Rack and its plans for the MI400 appearing next year


  • AMD has highlighted the MI350 series to Hot Chips 2025 with an evolution of the node in Rack
  • MI355X DLC Rack includes 128 GPU 36TB HBM3E and 2.6 Exafops
  • The Vera Rubin system of Nvidia to come next year is a beast on a maximum scale

AMD used the recent Hot Chips 2025 event to talk more about Architecture DNC 4 which feeds its new MI350 Instinct series, and show how its accelerators evolve from node to rack.

The platforms of the MI350 series combine 5th generation EPCU processors, MI350 GPUs and Pollara AMD NICs in standard OCP conceptions with networking supported by UEC. The bandwidth is delivered by the infinity fabric up to 1075 GB / s.

At the upper end of this is the Rack MI355X DLC ‘Orv3’, a 2 or 128 GPU system, 36 TB of HBM3E memory and a cutting edge of 2.6 exaflops at FP4 Precision (there is also an EIA version of 96 GPU with 27 TB of HBM3E).

(Image credit: AMD)

Here is Vera Rubin

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