- 2mm-thick mSSD achieves write speeds of 6,500 MB/s despite its size
- Longsys eliminates nearly 1,000 solder joints with wafer-level integration technology
- microSSD reduces defect rates from 1,000 DPPM to just 100
Longsys introduced what it calls the first integrated package microSSD, or mSSD, using a design that merges several key components into a single compact package.
The mSSD measures just 20 x 30mm and is just 2mm thick and weighs just 2.2 grams.
Despite its size, it supports PCIe Gen4x4 performance, achieving sequential read speeds of up to 7,400 MB/s and write speeds of up to 6,500 MB/s.
Integrated chip packaging
This device achieves random read and write figures of up to 1,000,000 and 820,000 IOPS respectively, keeping performance in line with larger M.2 drives.
Unlike traditional SSDs that rely on PCB assembly, mSSD uses System-in-Package (SiP) technology at the wafer level.
This approach integrates the controller, NAND flash, power management IC, and other passive components into a single package.
This eliminates nearly 1,000 solder joints typically found in PCB-based SSDs.
Longsys states (originally in Chinese) that this change improves overall reliability by reducing the defect rate from less than or equal to 1,000 defective parts per million to less than or equal to 100.
The move also removes several manufacturing steps, such as PCB placement and reflow soldering, reducing complexity and the risk of solder mask contamination or heat damage.
Thanks to this system, Longsys claims to now be able to manufacture the wafer to the finished product in a single process.
The company claims this doubles delivery efficiency while reducing additional production costs by more than 10%.
The design would also reduce energy consumption by removing the high-energy surface-mount process, which can help control carbon emissions and support environmental friendliness.
For thermal performance, Longsys uses a combination of aluminum alloy brackets, graphene patches, and thermally conductive silicone to help dissipate heat.
It meets NVMe power standards, with unused power below 3.5 milliwatts and maximum usage within specifications.
The Longsys mSSD supports both TLC and QLC NAND with capacities ranging from 512GB to 4TB.
It also includes a modular snap-on heatsink that can expand the form factor to M.2 2230, 2242, or 2280 standards without tools.
This makes it adaptable to a wide range of devices such as professional laptops, handheld consoles, drones and VR headsets.
The mSSD is currently in the ramp-up phase for mass production, with patents filed both nationally and internationally.
While its small size and integrated design may appeal to manufacturers, its advanced packaging process could make it more expensive than traditional portable SSDs at launch.
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