- Socamm is a new modular memory factor exclusive to Nvidia systems
- Micron says that Socamm offers a high bandwidth, low power and smaller imprint
- SK Hynix provides for the production of Socamm as the infrastructure demand is increased
During the recent NVIDIA GTC 2025, Memory Makers Micron and SK Hynix took respective Socamm solutions.
This new modular memory form factor is designed to unlock the full potential of AI platforms and has been developed exclusively for the Grace Blackwell platform in Nvidia.
Socamm, or memory module attached to the contour compression, is based on LPDDR5X and intended to meet the growing requests for performance and efficiency in AI servers. The form factor offered a higher bandwidth, lower energy consumption and a smaller imprint compared to traditional memory modules such as RDIMMS and MRDIMMS. Socamm is specific to NVIDIA AI architecture and therefore cannot be used in AMD or Intel systems.
More profitable
Micron announced that he would be the first to ship Socamm products in volume and its 128 GB Socamm modules are designed for the NVIDIA GB300 Grace Blackwell Ultra Superchip.
According to the company, the modules offer more than 2.5 times the bandwidth of RDIMMS while using a third of the power.
The 14×90 mm compact design is intended to support effective servers and thermal management.
“AI leads to a paradigm shift in computer science, and memory is at the heart of this development,” said Raj Narasimhan, main vice-president and general manager of the commercial calculation and networking unit of Micron.
“Micron’s contributions to the Nvidia Grace Blackwell platform make the performance and benefits of energy saving for AI training and inference applications.”
SK Hynix also presented its own low -power Socamm solution to the GTC 2025 as part of a wider IA memory portfolio.
Unlike Micron, the company has not come into detail on this subject, but said it positions Socamm as a key offer for future IA infrastructure and plans to start mass production “in accordance with the emergence of the market”.
“We are proud to present our range of advanced products at the GTC 2025,” said SK Hynix president and AI chief Infra Juseon (Justin) Kim.
“With a differentiated competitiveness in the memory space of AI, we are on the right track to bring our future as a full IA memory supplier.”
